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Equipment VFD-101 FM igbt_power_module_failure ISO 14224 mode IGBT power module failure IGBT power module failure Source synthetic + standards-based engineering estimate (ISO 14224 / IEC 61800 / IEEE C57 框架归类)
IGBT 功率模块失效
VFD-101 · Variable Frequency Drive (VFD)
Related equipment → VFD-101
0.82Source conf.
—Evidence conf.
IGBT power module failureISO 14224 mode
1Failure Mechanism

Function:将直流逆变为可变频率/电压交流，驱动电机

Failure cause:过流/过温/电压尖峰致结温超限，键合线疲劳脱落或芯片烧毁

Damage mechanism：IGBT 模块在功率循环热应力下键合线（wire bond）疲劳断裂与栅氧击穿（Coffin-Manson 热疲劳），导致短路/开路

2Source Basis (where this FM comes from)
synthetic + standards-based engineering estimate (ISO 14224 / IEC 61800 / IEEE C57 框架归类)

Source confidence 0.82: this FM is derived from the ontology KB and cross-validated by synthetic + standards-based engineering estimate (ISO 14224 / IEC 61800 / IEEE C57 框架归类).

3Evidence Chain (supporting basis)
This FM has no offline curated evidence text; it is derived from the ontology KB and cross-validated by the listed standard clauses and related accident investigations.
Governing standards (evidence)：
  • std:IEC 61800-5-1 — Adjustable speed electrical power drive systems — Safety requirements · 机理级工程估计，非实测；引用 governing standard 作为分类出处
  • std:IEC 61800-3 — Adjustable speed electrical power drive systems — EMC requirements · 机理级工程估计，非实测；引用 governing standard 作为分类出处
  • std:IEC 60146 — Semiconductor converters — General requirements and line commutated converters · 机理级工程估计，非实测；引用 governing standard 作为分类出处
  • std:IEC 60747 — Semiconductor devices — Discrete devices · 机理级工程估计，非实测；引用 governing standard 作为分类出处
4Related Real Accidents (traceable to accident cards)
NUREG-IN-94-51NUREG-LER-2006-004-FERMI2

This FM is recorded in 2 real accident investigation(s); tap the report no. to open the corresponding accident lesson card.

5Applicable Standards & Clauses
IEC 61800-5-1IEC 61800-3IEC 60146IEC 60747

No separate clause reference.

6Derived Analysis (seeded from this FM)
7/3/3FMEA Sev/Occ/Det
0.08RBI λ
0.8Monitor pdet
12 月Insp. int.

Current tasks:在线驱动温度/电流趋势 | IGBT 结温模型预警 | 备用模块轮换

RCFA incident:IGBT 功率模块失效：过流/过温/电压尖峰致结温超限，键合线疲劳脱落或芯片烧毁，后果类型 Operational/Safety，严重度 7

7RCM Maintenance Decision (strategy landing)
CBMOn-Condition Maintenance
Recommended task无损检测(UT/MT/PT) 监测裂纹萌生, 关键转动件定时拆检; 温度/红外热成像监测, 超温报警与根因排查; 绝缘/电气试验 + 继电保护定值校核 + 操动机构特性测试
Suggested intervalHigh risk 1-3 mo / Medium 6-12 mo / Low risk at turnaround (by API 581 RBI risk ranking)
Decision basis机理类别=electrical; fatigue; overheat
Governing standards
API 530API 579API 612ASME VIIIGB/T 14285IEC 60034IEEE C57厂家规范
⚠ This decision is engineering-inferred by RCM logic from the damage mechanism / root cause / failure cause — it is not derived from measured site history. Confirm with the equipment owner and process before execution.
⚠ 本卡技术正文（功能 / 致因 / 损伤机理 / RCFA 叙事）保留中文原文——依可信 AI 红线，自由技术文本不自动机翻、不编造英文译文。UI、设备类型、FM 名、ISO 码、标准号均为英文。
FM igbt_power_module_failure · Data from OPC KB and whitelisted public sources, compiled by Reliability AI for reliability demonstration only. Evidence ref codes are internal indices, not public DOIs.